钎焊接头金属间化合物层形貌对扩散浓度和应力的影响
刘文斌, 李宏萍, 张旭东, 孙学敏, 任军强
Influence of the morphology of intermetallic compound layer in the soldering joint on diffusion concentration and stress
LIU Wen-bin, LI Hong-ping, ZHANG Xu-dong, SUN Xue-min, REN Jun-qiang
兰州理工大学学报
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2022, (1): 14
-19
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