钎焊接头金属间化合物层形貌对扩散浓度和应力的影响

兰州理工大学学报 ›› 2022, Vol. 48 ›› Issue (1): 14-19.

钎焊接头金属间化合物层形貌对扩散浓度和应力的影响

刘文斌¹, 李宏萍¹, 张旭东², 孙学敏³, 任军强^*3

1.云南锡业集团(控股)有限责任公司研发中心, 云南昆明 650106;
2.西安交通大学网络信息中心, 陕西西安 710049;
3.兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室, 甘肃兰州 730050

收稿日期:2021-08-19 出版日期:2022-02-28 发布日期:2022-03-09
通讯作者: 任军强(1979-),男,甘肃静宁人,博士,副研究员.Email:shrekren520@126.com
基金资助:
国家自然科学基金(52061025),云南省重大专项基金(202002AB080001-2)

Influence of the morphology of intermetallic compound layer in the soldering joint on diffusion concentration and stress

LIU Wen-bin¹, LI Hong-ping¹, ZHANG Xu-dong², SUN Xue-min³, REN Jun-qiang³

1. Research and Development Center, Yunnan Tin Group (Holding) Company Limited, Kunming 650106, China;
2. Network Information Center, Xi'an Jiaotong University, Xi'an 710049, China;
3. State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou Univ. of Tech., Lanzhou 730050, China

Received:2021-08-19 Online:2022-02-28 Published:2022-03-09

摘要/Abstract

摘要： 结合实验结果,建立了芯片封装技术中焊点金属间化合物(IMC)界面模型,采用有限元方法计算了模型中Sn钎料与Cu焊盘形成IMC层时Cu原子的扩散过程以及扩散应力大小与分布.结果表明:IMC层与钎料的界面形貌可显著影响Cu原子扩散浓度及应力行为.凹凸界面形貌会严重阻碍Cu原子的扩散,且靠近界面影响更为显著;扇贝形界面模型比平坦界面模型更快达到扩散平稳态;最终扇贝界面模型中Cu原子浓度比平坦界面模型中Cu原子浓度小,这使得扇贝界面模型中扩散应力影响区域整体比平坦界面模型中的小.

关键词: 焊接接头, 金属间化合物, 扩散应力, 有限元

Abstract: Combining the experimental results, the intermetallic compound (IMC) interface model of welded joint in chip packaging technology was established. The diffusion process of Cu atoms during the formation of IMC layer between Sn solder and Cu substrate was calculated by finite element method, including the diffusion-induced stress and stress distribution. The results show that the interface morphology of IMC layer can significantly affect the behavior of Cu atoms diffusion and diffusion-induced stress. The concave-convex morphology of interface seriously obstructs the diffusion of Cu atoms, and the effect is more significant near the interface. The scallop morphology interface reaches diffusion stabilization faster than the flat morphology interface. The Cu atom concentration in the scallop interface is smaller than that in the flat interface, which makes the diffusion stress-affected region in the scallop interface smaller than that in the flat interface model.

Key words: welded joint, intermetallic compound (IMC), diffusion-induced stress, finite element method

中图分类号:

TG454

刘文斌, 李宏萍, 张旭东, 孙学敏, 任军强. 钎焊接头金属间化合物层形貌对扩散浓度和应力的影响[J]. 兰州理工大学学报, 2022, 48(1): 14-19.

LIU Wen-bin, LI Hong-ping, ZHANG Xu-dong, SUN Xue-min, REN Jun-qiang. Influence of the morphology of intermetallic compound layer in the soldering joint on diffusion concentration and stress[J]. Journal of Lanzhou University of Technology, 2022, 48(1): 14-19.

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