Analysis of temperature field and thermal stresses of thermoelectric material beams under transient thermal shock

Abstract

Abstract: Based on the characteristics of thermoelectric materials, the governing equations of the transient model of thermoelectric materials are obtained by the thermoelectric equilibrium equation and constitutive equation. The nonlinear transient temperature field of the thermoelectric material beam is obtained by using the separated variable method combined with the initial and boundary conditions of the model, and the transient thermal stress field is obtained according to the thermal stress theory analysis. Then the characteristic curves of the transient temperature field and transient thermal stress field of the thermoelectric material beam with parabolic distribution are given by using the mathematical software MATLAB. The thermal stress analysis of thermoelectric material beam under thermal shock load in thermoelectric coupling environment is studied. The changes of temperature field and stress field with thickness at different times are discussed, and the thermal stress characteristic curves of p-type and n-type Bi₂Te₃ thermoelectric material beams are compared. The results show that the transient temperature field increases and decreases with the increase of thickness under the influence of transient term, and the transient temperature field and transient thermal stress field finally tend to steady state and no longer change with time; the thermal stress of Bi₂Te₃ thermoelectric material beam after steady state is greater than that of transient state; the thermal stress of p-type Bi₂Te₃ thermoelectric material beam is always greater than that of n-type Bi₂Te₃ thermoelectric material beam.

Key words: thermoelectric material, beams, transient, thermal shock, temperature field, thermal stresses

CLC Number:

O343

TENG Zhao-chun, YANG Wen-xiu. Analysis of temperature field and thermal stresses of thermoelectric material beams under transient thermal shock[J]. Journal of Lanzhou University of Technology, 2021, 47(6): 165-171.

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