Effect of aging on microstructure and properties of deformed Cu-Zr-Si alloy

Abstract

Abstract: Equal-channel angular pressing (ECAP) technique was employed to perform single-pass deformation of Cu-0.16Zr-0.04Si alloy at room temperature and liquid-nitrogen low temperature, and then the alloy was aged at 450 ℃ for 4 h. The effect of aging on the microstructure of the alloy were investigated by scanning electron microscopy (SEM) and X-ray energy spectroscopy (EDS) and the alteration of mechanical properties and electrical conductivity of the alloy were analyzed. The result showed that after the alloy being deformed and aged, an ununiformity distributed rod-like or granular precipitated phase would appear at the grain boundary and a dispersively distributed fine point-like precipitated phase would appear in the matrix. The tensile strength and electrical conductivity of the alloy would be improved synchronously after deformation and aging treatment. With the aging time prolonged, the fracture toughness of the alloy would gradually deteriorate.

Key words: copper alloy, aging, precipitation phase, strength, electrical conductivity

CLC Number:

TG379

GUO Ting-biao, WU Yi-bo, WEI Shi-ru, WANG Bing, MA Di, JIA Zhi. Effect of aging on microstructure and properties of deformed Cu-Zr-Si alloy[J]. Journal of Lanzhou University of Technology, 2020, 46(2): 1-6.

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